Foundry Technology Development - Staff Far Back-End (FBE) Engineer

Job Description As the world's largest chip manufacturer, and a global leader in innovation and new technology, Intel strives to make every facet of semiconductor manufacturing state-of-the-art - from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.
Employees in the Logic Technology Development (LTD) group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth.
We're constantly working on making a more connected and intelligent future, and we need your help.
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What we offer: We foster a collaborative, supportive, and exciting environment where the brightest minds in the world come together to achieve exceptional results.
We give you opportunities to transform technology and create a better future, by delivering products that touch the lives of every person on earth.
What we do: The Logic Technology Development (LTD) organization delivers the latest process technology innovations to drive Intel's amazing product roadmap.
To maintain the Torrid pace of technology and meet our customer demands, Intel must continue to drive technology and capability improvements.
The Foundry Technology Development Senior Staff FBE (Far Back End) Engineer will engage with foundry customers to support product development in test, bump, and assembly across the foundry silicon technology life cycle from process technology evaluation, pre-silicon design, through product silicon development, wafer manufacturing, and volume ramp.
Take a look at Life Inside Intel HERE What you will do: Serve as the primary Intel process expert and main interface between Intel Assembly Test Technology Development (ATTD), Intel Logic Technology Development (LTD), the Intel Foundry Services (IFS) business unit, and external foundry customers to drive timely process/design solutions for test, assembly, and packaging.
Provide regular communication and report outs on foundry process development progress and product health to Intel senior management and external customers.
Support product development on foundry silicon technology aspects potentially including process definition, wafer costs, IP and product design execution, process modeling and design rules, mask tapeout, through silicon manufacturing.
Own and manage LTD's response to customer requests and issues for process technology and manufacturing.
Coordinate and manage all LTD customer technology deliverables, maintain and track process program and product Plan of Record and represent plans in internal execution planning.
Collaborate with Process Integration, Device, and Design Enablement teams to ensure the highest-quality Process Design Kit (PDK) technology collaterals and support design usage.
May include examination of metrology, E-test, and yield process data, design rule and layout effect assessments, design rule waiver reviews, and product parametric correlation.
Collaborate with Yield, Device, and product engineering central teams to drive improvement changes to product design and process to achieve optimum product yield and performance and support silicon test/debug.
Define and drive foundry customer service best practices, IP/data management and systems, and improvements to fab and development operational systems and methodologies to improve efficiency and standardization in a developing business Benefits: We provide benefits that promote a healthy, enjoyable life: excellent medical plans, wellness programs and amenities, time off, recreational activities, discounts on various products and services, and many more creative perks that make Intel a Great Place to Work.
Intel's approach for the future of work is grounded in our belief that our people are our most important asset.
While we know we don't have all the answers for what will work best long-term, the data shows that many workers are looking for increased flexibility, and that's why we're leading with a hybrid-first approach.
This is a hybrid position.
Learn more about our Amazing Benefits HERE Qualifications Minimum qualifications are required to be initially considered for this position.
Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Minimum Qualifications: Master's Degree with 5+ years of experience OR PhD Degree with 3+ years of experience.
Accepted degrees in Electrical Engineering, Materials Science, Physics, Chemical Engineering or other relevant engineering or physical science discipline.
The years of related work experience listed above must be 5+ (MS) or 3+ (PHD) in semiconductor foundry technology experience in far back end (FBE) including Si bumping, substrate manufacture, assembly, packaging, and test.
Preferred Qualifications: - Semiconductor foundry technology experience in far back end (FBE) including Si bumping, substrate manufacture, assembly or test.
- 2+ years of foundry customer service experience and evidence of strong customer orientation.
- Applied industrial experience in at least one or more of the following technical areas: Semiconductor process integration, yield enhancement, device physics, logic, architecture and integration or development on leading edge technology nodes.
IC wafer fabrication process engineering, manufacturing systems, semiconductor materials, and wafer test (e.
g.
fabrication areas may include photolithography and advanced patterning, thin film deposition, planarization, defect metrology or spectroscopy).
Experience/knowledge of macroscopic failure analysis or characterization methods including but not limited to SEM, EDX, Surface Acoustic Microscopy, 3D XRay, bump shear etc.
Experience interpreting product data including inline, e-test and SORT data, finding failure root cause and inline indicator and driving for solutions.
Knowledge of inline inspection methods, electrical test structures and SORT programs.
Process Design Kit (PDK) design rule analysis and use Inside this Business Group As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art - from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.
Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.
Other Locations US, AZ, Phoenix; US, CA, Folsom; US, CA, Santa Clara Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Benefits We offer a total compensation package that ranks among the best in the industry.
It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation.
Find more information about all of our Amazing Benefits here.
Annual Salary Range for jobs which could be performed in US, California: $123,139.
00-$203,801.
00 *Salary range dependent on a number of factors including location and experience Working Model This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site.
In certain circumstances the work model may change to accommodate business needs.
JobType Hybrid